Technical challenges pose no problem for us 

  • Radio and high frequency technology
  • Special requirements regarding materials, housing, LP, etc.
  • Solderability test, creation of solder profile, soldering agent testing
    Analyses of components (ex. according to IPC 610
  • Visual (light microscopic) inspections
  • Shock, fall, and vibration test
  • Strength tests (tensile, burst, and shear strength)
  • Surface testing (coating thickness, abrasion resistance, roughness)
  • LP analyses according to IPC600 or Perfag
    (UL registration, grindings, imped. control LP, contamination, cross cut)
  • X-Ray examinations